LITTLEBLACKDOG.COM

Moderator Joined: 05 Dec 2000 Posts: 5941 Location: USA

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A perfect example of "snagging the idea" in case you need it later...

From : [url]http://164.195.100.11/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=/netahtml/search-adv.htm&r=15&f=G&l=50&d=FT00&s1=(%60advanced+micro+devices,+inc%60.ASNM.)&p=1&OS=an[/url]

A package for housing a device (e.g., an integrated circuit chip or die) is disclosed including a ball grid array substrate and a thermoelectric cooler (e.g., a Peltier effect device). The thermoelectric cooler is housed within the package. The thermoelectric cooler is coupled to the ball grid array substrate and includes a hotter portion and a cooler portion in response to an electric potential difference. The thermoelectric cooler receives the electric potential difference from the package.

squito@wi.rr.com

Posted: Sat Mar 10, 2001 4:18 pm Post subject:

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Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA)

dose that mean that AMD gets the money when others use the BGA technonlogy:?:
-g

Posted: Sat Mar 10, 2001 7:37 pm Post subject:

I think they plan on imbedding a peltier device inside the BGA package to help dissipate heat.

Posted: Sat Mar 17, 2001 11:13 am Post subject:

i guess that means when thoes chipsets get to hot to overclock we look to AMD for the answer then?
-g

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